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Ni/Cu Composite Plate High Thermal Conductivity for Electronics
High thermal conductivity Ni/Cu composite plates for electronics. Ready to ship in 7-20 days. Pure Ni-Cu metallurgical bond. Custom slitting within 24 hours. ISO certified.
- Overview
- Applications
- DLX Alloy
- FAQs
- Recommended Products
Product Overview of Copper Nickel Clad Metal Sheet
Our Ni/Cu composite plate is a precision-engineered bimetallic material with pure nickel on one side and pure copper on the other. This nickel copper clad plate combines the outstanding thermal and electrical conductivity of copper with the corrosion resistance, weldability, and surface stability of nickel.
Designed specifically for electronics and high-power applications, the high thermal conductivity Ni/Cu composite plate ensures efficient heat dissipation while providing reliable electrical pathways. It is widely used in battery tabs, connectors, heat sinks, and electronic components where both performance and durability are critical.
Product Features of Copper Nickel Clad Metal Plate Supplier
1.Low IR Efficiency: The high-purity copper core ensures ultra-low internal resistance (IR), reducing heat generation during high-power fast charging and acceleration.
2.Weldability Excellence: The pure nickel surface is optimized for high-speed fiber laser welding, ensuring zero-defect joints with prismatic and cylindrical cells.
3.Unrivaled Bond Integrity: Our metallurgical bonding process ensures no delamination even under the extreme shock and vibration of a vehicle’s 10-year service life.
4.Thermal Cycling Stability: Specifically tested to maintain structural integrity across a -40°C to +125°C temperature range, matching automotive environment specs.
5.Consistency in Bulk: Advanced SPC (Statistical Process Control) ensures thickness and conductivity uniformity across multi-ton production lots.
Physical Properties & Chemical Composition
| Physical Properties | Pure Nickel Layer | Pure Copper Layer | Bimetal (Avg. at 20% Ni) |
|---|---|---|---|
| Density (g/cm³) | 8.89 | 8.96 | ~8.94 |
| Conductivity (% IACS) | ~22 | 100 - 101 | 82 - 88 |
| Thermal Conductivity (W/m·K) | 90.7 | 390 - 400 | ~330 |
| Elastic Modulus (GPa) | 207 | 110 - 128 | 135 - 150 |
| Material Layer | Ni (%) | Cu (%) | Fe (%) | C (%) | S (%) |
|---|---|---|---|---|---|
| Pure Nickel Side | 99.6 min | 0.10 max | 0.10 max | 0.05 max | 0.005 max |
| Pure Copper Side | - | 99.9 min | - | - | - |
Applications of Copper Nickel Clad Sheet Factory
1.IGBT Substrates: Rapid-response heat spreaders for high-power inverters in EVs and industrial automation.
2.High-Brightness LEDs: Core thermal PCBs that require both efficient heat path (Cu) and reflective surface (Ni).
3.Battery Busbars: High-conductivity interconnects for rapid-charging lithium battery packs and energy storage modules.
4.CPU/GPU Lids: Bimetallic heat spreaders that prevent oxidation while maximizing Z-axis thermal transfer.
5.Power Distribution Units: Transition pads for heavy-duty relays and circuit breakers where speed and reliability are paramount.
Key advantage：
✔Dual-Metal Synergy: Combines copper's 100% IACS conductivity with nickel’s superior spot-welding reliability.
✔Cold-Rolling Precision: Manufactured using high-precision mills to ensure cladding ratio uniformity within ±2%.
✔Automated Line Compatibility: Burr-free slitting and high flatness ensure zero jams in high-speed automated assembly equipment.
✔Transition Efficiency: Eliminates the need for transitional plating or mechanical clamping, simplifying module design.
⭐Company Intro - DLX Alloy
Changzhou DLX Alloy Co., Ltd. has redefined the supply model for the high-tech electronics and connector industries. Recognizing that market cycles are shrinking, we have moved beyond traditional "made-to-order" manufacturing to an agile, stock-driven supply chain. Our facility integrates large-scale production with a dedicated "Rapid Response Unit" that specializes in small-batch slitting and urgent prototyping. By maintaining a deep inventory of high-purity nickel-clad copper materials, we allow our global partners to reduce their own inventory carrying costs and respond instantly to new design requirements. At DLX, we don't just provide the metallurgical foundations for your connectors; we provide the speed and flexibility required to win in today’s competitive electronics landscape.
Quality & Standards : DLX implements a zero-defect quality system for battery materials. We utilize online ultrasonic testing to ensure 100% bond integrity and automated optical inspection (AOI) for surface defects. All materials are fully compliant with RoHS 3, REACH, and UL standards for electronic insulation and safety.
Forms: sheet, strips, or custom pre-cut tags.
Packaging: Vacuum-sealed anti-oxidation VCI bags inside reinforced wooden crates.
MOQ: 5kg for standard 2:8 ratio stock; 20kg for custom thickness or specific tempers.
Documentation: Full MTC (EN10204 3.1), RoHS compliance certificate, and Bond Strength Report.
FAQs:
Q1: What is the structure of this Ni/Cu composite plate?
A: It is a bimetallic clad plate with pure nickel on one side and pure copper on the other, bonded metallurgically to deliver high thermal conductivity from the copper side and corrosion resistance plus weldability from the nickel side.
Q2: Why is this Ni/Cu composite plate preferred for electronics thermal management?
A: The copper layer provides excellent thermal and electrical conductivity for efficient heat dissipation and low resistance, while the nickel layer offers corrosion protection, improved solderability, and durability in demanding electronic environments.
Q3: Can the nickel-to-copper thickness ratio be customized?
A: Yes. We offer flexible layer thickness ratios and overall plate dimensions to optimize thermal conductivity, conductivity, and mechanical properties for your specific electronics or battery application.
Q4: Is this nickel copper clad plate suitable for battery tabs and high-current connections?
A: Absolutely. The combination of high conductivity copper core and weldable nickel surface makes it ideal for battery tabs, reducing heat generation and voltage drop in high-drain electronics and energy storage systems.
